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The rise of COB (Chip on Board) technology in the display industry signifies the arrival of a new era. This technology enhances the brightness and color saturation of display screens by directly packaging LED chips onto a circuit board. It also strengthens the reliability and durability of the products. With continuous technological advancements and increasing market demands, COB technology has become a significant force in driving industry development.
As a leader in the industry, BOE's launch of its self-developed COB new series products has undoubtedly injected new vitality into the market. These new products not only achieve breakthroughs in technology but also demonstrate excellence in product performance and application fields.
In the current COB market, competition among enterprises is becoming increasingly fierce, while market demand continues to expand. Under such circumstances, how to enhance product competitiveness and achieve differentiation has become a focus of attention in the industry. BOE CrystalCore has released its self-developed new COB product series in this context, committed to breaking through in both high-end and cost-effectiveness to strengthen the product's competitiveness in the market.
The new series of COB products from BOE CrystalCore cannot be separated from the improvement of yield in R&D and manufacturing for high-end positioning, while cost-effectiveness is inseparable from production line experience and capacity. Additionally, following the laws of product development, in the production process, the product yield will increase in sync with technological strength and production experience. Based on these two points, BOE CrystalCore has mentioned its self-production and self-research model.
Self-production and self-research: In terms of production lines, BOE CrystalCore has established a COB production line in Beijing and has achieved mass production. In terms of R&D, the latest COB new series products released by BOE CrystalCore not only inherit the characteristics of the first generation products, such as full flip-chip common cathode, encapsulation with optical film, green and energy-saving, wide-angle without color difference, ultimate seam, and uniform ink color, but also have been全新升级 in appearance, configuration, size, and other aspects:
- The chip has been upgraded from 0408 to 0407.
- In appearance, BOE's unique optical film encapsulation scheme is used to further enhance the uniformity of ink color, while effectively reducing the seam, increasing flatness, and continuously improving anti-fouling and impact resistance.
- In terms of product configuration, the new COB P1.25 series products use a three-in-one board card, EMC Class B scheme, and dual link, providing double insurance for greater safety and stability.
- In terms of product size, a large panel technology route is implemented, with the module size upgraded to 150*168.75 mm.
Yield and ink color uniformity: Regarding the yield and ink color uniformity that are more concerned in COB products, BOE CrystalCore also stated that the current yield rate is 98%. For the issue of COB uniformity, a surface encapsulation process using a film lamination technique is adopted, and strict control of the specifications of the encapsulation film raw materials is ensured to guarantee a high degree of uniformity in ink color. Moreover, to ensure the picture quality of COB products, not only through the chip's mixed bin method, but also by using non-mixed/simple mixed methods to enhance the display effect, and then achieving picture quality uniformity through the multi-mixed method of the die bonding machine. Currently, BOE CrystalCore's COB covers the full range of products from P0.9 to P1.5, making differentiated layouts in terms of ultimate picture quality, green environmental protection, and safety and comfort, and has been mass-producing and shipping COB products steadily.